Measurement of Thermal-mechanical Wirebond Displacement in Electrically Active Power Semiconductors
[11] [12] [13] [14] [15] [16] [17] [18] [19] [20] [21] Bielen, J., Gommans, J.-J., and Theunis, F., aPrediction of high cycle ... Chip Scale Ball Grid Array Package, aquot; http:/ /ansys.net/papers/nonlinear/ finite element based solder joint fatigue.pdf, pp. 1- 16anbsp;...
| Title | : | Measurement of Thermal-mechanical Wirebond Displacement in Electrically Active Power Semiconductors |
| Author | : | Seth M. Avery |
| Publisher | : | - 2009 |
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